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Customized Waffle Micro Electronic Component Tray Structurally Standard

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Customized Waffle Micro Electronic Component Tray Structurally Standard

Brand Name : Hiner-pack

Model Number : 4Inch

Certification : ISO 9001 ROHS SGS

Place of Origin : Made In China

MOQ : 1000 pcs

Price : $0.35~$0.85(Prices are determined according to different incoterms and quantities)

Payment Terms : T/T

Supply Ability : 4500~5000PCS/per day

Delivery Time : 5~8 working days

Packaging Details : It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)

Material : ABS.PC.MPPO...etc

Color : Black.Red.Yellow.Green.White..etc

Temperature : General 80°C~100°C

Property : ESD,Non-ESD

Surface resistance : 1.0x10E4~1.0x10E11Ω

Warpage : less than 0.2mm(2Inch) 0.3mm(4Inch)

Clean Class : General and ultrasonic cleaning

Incoterms : EXW,FOB,CIF,DDU,DDP

Customized service : Suitable for all kinds of Bar.Die.Chip devices or parts

Injection mold : Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.)

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Customized Waffle Micro Electronic Component Tray Structurally Standard

Structurally Standard ESD PC Waffle Pack With Different Requirements Can Be Customized For Micro Electronic Component

Waffle pack has many applications including the packaging of die, die attach preforms and bond pads. Waffle pack is becoming a much more desirable form of packaging as component sizes continue to shrink.

Waffle pack has distinct advantages over taping, particularly with parts that are very small. Waffle packing permits the automated loading of parts as small as .0005.

As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.

Silicon dies can be delivered in a tray which is also known as waffle pack – a plastic tray with pockets that match the die size. A waffle pack has a lid and is delivered in an antistatic bag. Waffle packs are ideal for delivering small number of silicon dies, typically from a MPW process.


Product Application

Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging

Packaging


Packaging Details:Packing according to customer's specified size

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

Cavity Size Customized Size
Item Material: ABS / PC / MPPO / PPE... acceptable
OEM & ODM: YES
Item Color: Can be customized
Feature: Durable;Reusable;Rcofriendly;Biodegradable
Sample: A. The free samples: choosen from existing products.
B. customized samples as per your design/demand
MOQ: 500pcs.
Packing: Carton or as per customer's request
Delivery time: Usually 8-10 working days,depends on order quantity
Term of payment: Products:100% prepayment. Mold:50% T/T deposit, 50% balance after sample confirmation

Customized Waffle Micro Electronic Component Tray Structurally Standard

Customized Waffle Micro Electronic Component Tray Structurally Standard
FAQ

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Customized Waffle Micro Electronic Component Tray Structurally Standard


Product Tags:

Waffle Electronic Component Tray

      

PCBA Electronic Component Tray

      

Waffle IC Chip Tray

      
China Customized Waffle Micro Electronic Component Tray Structurally Standard wholesale

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