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ODM Gray Color Waffle Pack Conductive Tray For Transfer IC

Shenzhen Hiner Technology Co.,LTD
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ODM Gray Color Waffle Pack Conductive Tray For Transfer IC

Brand Name : Hiner-pack

Model Number : 70*70-25

Certification : ISO 9001 ROHS SGS

Place of Origin : Made In China

MOQ : 1000 pcs

Price : $0.35~$0.85(Prices are determined according to different incoterms and quantities)

Payment Terms : T/T

Supply Ability : The capacity is between 4500PCS~5000PCS/per day

Delivery Time : 5~8 working days

Packaging Details : It depends on the QTY of order and size of product

Material : ABS

Color : Gray

Temperature : N/A

Property : ESD

Surface resistance : 1.0x10E4~1.0x10E11Ω

Flatness : less than 0.2mm

Clean Class : General and ultrasonic cleaning

Use : Transport,Storage,Packing

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ODM Gray Color Waffle Pack Conductive Tray For Transfer IC

Factory Custom-Made Waffle Packs For Transfer Of Electronic Components

For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products,In order to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.

Our Advantages

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years’ex perience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

Detail Information

Outline Line Size 50.7*50.7*4mm Brand Hiner-pack
Model 70*70-25 Package Type IC Die
Cavity Size 1.78*1.78*0.64mm Matrix QTY 20*20=400PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

Product Application

Electronic component Semiconductor Embedded System Display technology

Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply

ODM Gray Color Waffle Pack Conductive Tray For Transfer IC

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

ODM Gray Color Waffle Pack Conductive Tray For Transfer IC


Product Tags:

Waffle Conductive Tray

      

ODM Waffle Conductive Tray

      

Waffle esd component tray

      
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