Sign In | Join Free | My ccnmag.com
China Shenzhen Hiner Technology Co.,LTD logo
Shenzhen Hiner Technology Co.,LTD
Verified Supplier

5 Years

Home > Jedec IC Trays >

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type

Shenzhen Hiner Technology Co.,LTD
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type

Brand Name : Hiner-pack

Model Number : HN21062

Certification : ISO 9001 ROHS SGS

Place of Origin : Made In China

MOQ : 1000 pcs

Price : $1.35~$2.38(Prices are determined according to different incoterms and quantities)

Payment Terms : T/T

Supply Ability : The capacity is between 2500PCS~3000PCS/per day

Delivery Time : 5~8 working days

Packaging Details : 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Material : PPE

Color : Black

Temperature : 150°C

Property : ESD

Surface resistance : 1.0x10E4~1.0x10E11Ω

Flatness : less than 0.76mm

OEM&ODM : Accept

Mold Type : Injection

Contact Now

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type

High Quality Jedec IC Tray For LGA Chip Package Type

  • ROHS Customized high temperature tray for LGA chip placement function

Quick Description:

Outline Line Size

322.6*135.9*8.5mm

Brand

Hiner-pack

Model

HN 21062

Package Type

LGA

Cavity Size

28.2*28.2*3.35mm

Matrix QTY

3*9=27PCS

Material

PPE

Flatness

MAX 0.76mm

Color

Black

Service

Accept OEM,ODM

Resistance

1.0x10e4-1.0x10e11Ω

Certificate

ROHS

In the microelectronics industry, there are standards for handling, loading, transporting and storing integrated circuit IC, modules and other electronic components. This is usually referred to as Jedec standard matrix trays. The Jedec Standard Tray is made from molded plastic particles. The Jedec standard Tray is very strong with minimal warpage control to achieve maximum protection of these components.

All Jedc matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN... And so on.

Many Jedec tray slots are designed in the middle of the tray to allow automatic equipment to pick up the loaded product.

45-degree chamfer is also easier for equipment to identify and locate, thereby reducing labor costs.

Poduct Application

Package IC PCBA module component

Electronic component packaging Optical device packaging


Packaging Details:Packing according to customer's specified size

Reference to temperature resistance of different materials

Material

Bake Temperature

Surface Resistance

PPE

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Carbon Fiber

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Carbon Powder

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Glass Fiber

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

PEI+Carbon Fiber

Max 180°C

1.0*10E4Ω~1.0*10E11Ω

IDP Color

85°C

1.0*10E6Ω~1.0*10E10Ω

Color, temperature and other special requirements can be customized

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type


Product Tags:

ESD Jedec IC Tray

      

PPE Jedec IC Tray

      

LGA Jedec IC Tray

      
China PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type wholesale

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Hiner Technology Co.,LTD
*Subject:
*Message:
Characters Remaining: (0/3000)